ZTE Chooses Intelís eASIC Devices for 5G Wireless Deployment
May 2, 2019
selected Intel eASIC devices for its 5G wireless products. ZTE selected
Intel eASIC devices to meet the critical cost and power requirements
demanded by large-scale 5G deployments.
Dan McNamara, Intel senior vice president and general manager of the
Programmable Solutions Group said, ďIntelís alliance with ZTE marks a
major milestone in Intel eASIC devicesí 5G penetration. 5G speeds will
enable new classes of applications, resulting in an exponential increase
in data volume. Our customers need solutions that allow them to design
optimal systems they can take to market quickly. Intelís structured and
standard ASICs enable ZTE to achieve critical cost goals and cement
their position in the exploding 5G market.Ē
As 5G rollout moves from the trial phase to initial deployment, carriers
need flexible solutions based on field programmable gate arrays (FPGAs).
FPGAs provide hardware programmability to meet both prototyping and
initial production requirements. As the 5G rollout transitions to
high-volume production, FPGAs transition to ASICs to meet cost and power
targets associated with high-volume shipments. Intelís recent
acquisition of eASIC enables a smooth transition from FPGA-based designs
to structured ASICs.
ZTE used FPGAs for rapid prototyping and early production. The company
needed to quickly transition to a lower unit cost and reduced-power
solution for high-volume deployment.
ďIntel eASIC devices provide good power and cost benefits for our 5G
wireless products and were essential to make a fast transition to meet
our low cost and power requirements,Ē said Duan Xiang Yang, vice
president and general manager of Wireless System Architect at ZTE.
It Does: A structured ASIC is an intermediary technology between FPGAs
and standard-cell ASICs that provides unit-cost reduction and improved
power efficiency. Structured ASICs offer benefits like those offered by
standard-cell ASICs, but with faster development time. Intel eASIC
devices are structured ASICs that provide a smooth design transition
from any FPGA. They reduce unit cost and power consumption compared to
FPGAs. These two benefits are especially important for high
volume-markets, such as 5G radio.
ZTE was able to meet time-to-market requirements using FPGAs for its 5G
design. The smooth transition to an eASIC structured ASIC device reduces
the designís bill of materials (BOM) cost and power consumption, which
is required for high-volume production. The combination of FPGAs and
Intel eASIC structured ASICs allows customers to meet diverse
time-to-market, flexibility, performance, low-power and unit-cost
What the Future Holds: The combination of Intel FPGAs, Intel eASIC
devices and Embedded Multi-die Interconnect Bridge (EMIB) technology
will enable a new device class with flexibility, lower unit cost and
power efficiency, all in a single package.